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InP-based pin TWA photoreceivers with low group delay scatter over 40 GHz bandwidth

: Bach, H.-G.; Schlaak, W.; Mekonnen, G.G.; Seeger, A.; Steingrüber, R.; Schramm, C.; Jacumeit, G.; Ziegler, R.; Umbach, A.; Unterborsch, G.; Passenberg, W.; Ebert, W.; Eckardt, T.

Koch, T. ; IEEE Communications Society; IEEE Lasers and Electro-Optics Society; Optical Society of America -OSA-, Washington/D.C.:
Optical Fiber Communication Conference 2000. Technical digest. Postconference edition : March 7 - 10, 2000, Baltimore Convention Center, Baltimore, Maryland, OFC 2000, [25th anniversary]
Washington, DC: OSA, 2000 (Trends in optics and photonics series 37)
ISBN: 1-557-52630-3
ISBN: 0-7803-5952-6
ISBN: 0-7803-5953-4
Optical Fiber Communication Conference (OFC) <2000, Baltimore/Md.>
Conference Paper
Fraunhofer HHI ()
delays; HEMT integrated circuits; iii-v semiconductors; indium compounds; integrated circuit packaging; integrated optoelectronics; light scattering; modules; optical receivers; p-i-n photodiodes; InP-based pin twa photoreceivers; low group delay scatter; GHz bandwidth; gb/s photoreceiver oeics; thermo-stable module packaging; tdm applications; waveguide-integrated photodiode; traveling wave amplifier; group delay scatter; 40 Gbit/s; 40 GHz; inp

Advanced 40 Gb/s photoreceiver OEICs, packaged into thermo-stable modules, were developed for 1.55 micron TDM applications. The OEIC comprises a waveguide-integrated photodiode and a traveling wave amplifier with a group delay scatter |+or-7 ps| up to 45 GHz.