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2000
Conference Paper
Titel
InP-based pin TWA photoreceivers with low group delay scatter over 40 GHz bandwidth
Abstract
Advanced 40 Gb/s photoreceiver OEICs, packaged into thermo-stable modules, were developed for 1.55 micron TDM applications. The OEIC comprises a waveguide-integrated photodiode and a traveling wave amplifier with a group delay scatter |+or-7 ps| up to 45 GHz.
Language
English
Tags
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delays
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HEMT integrated circuits
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iii-v semiconductors
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indium compounds
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integrated circuit packaging
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integrated optoelectronics
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light scattering
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modules
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optical receivers
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p-i-n photodiodes
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InP-based pin twa photoreceivers
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low group delay scatter
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GHz bandwidth
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gb/s photoreceiver oeics
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thermo-stable module packaging
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tdm applications
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waveguide-integrated photodiode
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traveling wave amplifier
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group delay scatter
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40 Gbit/s
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40 GHz
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inp