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Eco-design workflow process

 
: Vasko, C.; Szendiuch, I.; Schischke, K.

International Microelectronics and Packaging Society -IMAPS-:
EMPC 2007, the 16th European Microelectronics and Packaging Conference & Exhibition. Proceedings. Pt. 2 : June 17 - 20, 2007, Oulu, Finland
Oulu, 2007
ISBN: 978-952-997511-2
pp.459-462
European Microelectronics and Packaging Conference and Exhibition (EMPC) <16, 2007, Oulu>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-129338.html