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Model of PVD sputter deposition for a process simulation by FEM

: Westkämper, E.; Gottwald, B.

Chiffre, L. de; Carneiro, K. ; Center for Geometrical Metrology, Lyngby; Technical University of Denmark -DTU-, Department of Manufacturing Engineering, Lyngby; Danish Institute for Fundamental Metrology; International Institution for Production Engineering Research -CIRP-, Paris; European Society for Precision Engineering and Nanotechnology -EUSPEN-:
1st EUSPEN Topical Conference on Fabrication and Metrology in Nanotechnolgy 2000. Proceedings
Lyngby, 2000
pp.198-205 (Vol.1)
Conference on Fabrication and Metrology in Nanotechnology <1, 2000, Copenhagen>
Conference Paper
Fraunhofer IPA ()
process modeling; PVD; physical vapour deposition; Finite-Elemente-Methode (FEM); Prozeßmodell

The PVD sputter deposition has gained a high importance within coating techniques and is largely used for in precision deposition. Generally, the coating technology is characterised by empiricial strategies, which results in high starting times and production costs. Typical examples in this area are hard coatings for machine tools, high reflection layers for laser glasses and metal conductor paths for circuit boards in combination with lithography and etching. This article shows how the process reliability of PVD sputter deposition could be improved with the help of process models and explanatory models which are to be examined.