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Thermo-mechanical stress analysis

 
: Niehoff, K.; Schreier-Alt, T.; Schindler-Saefkow, F.; Ansorge, F.; Kittel, H.

International Microelectronics and Packaging Society -IMAPS-, Italian Chapter; Institute of Electrical and Electronics Engineers -IEEE-:
EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM : June 15th-18th, 2009 , Rimini, Italy
New York, NY: IEEE, 2009
ISBN: 0-615-29868-0
ISBN: 978-0-615-29868-9
ISBN: 978-1-4244-4722-0
pp.497-501
European Microelectronics and Packaging Conference and Exhibition (EMPC) <17, 2009, Rimini>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper reports about the development and application of a new test chip for stress analysis in microelectronic packaging processes and reliability tests. Special focus will be on transfer molding with epoxy molding compound (EMC). The CMOS based stress sensor is able to measure in-plane normal stress and shear stress on the chip surfaces with an absolute stress resolution of +/- 3MPa. By the use of a multiplexer and an array of measuring cells on the chip surface we are able to sense temperatures and mechanical stresses space- and time resolved We analyzed 1(st) and 2(nd) level encapsulation methods by transfer and injection molding and performed an in-situ relaxation and stress monitoring of the packaged sensor during temperature load and moisture uptake. The experimental results will be compared with numerical simulations. In substitutive application for electronic parts, the test chip implicates a major potential for investigating production processes and lifetime impacts on MEMS. Adjusting material combinations and optimizing packaging processes to achieve reliable products will be the applications on focus in future.

: http://publica.fraunhofer.de/documents/N-125149.html