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Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies

 
: Middendorf, A.; Griese, H.; Reichl, H.; Grimm, W.

:

IEEE:
Integrated Reliability Workshop Final Report, 2002. IEEE International
2002
ISBN: 0-7803-7558-0
pp.176 - 179
International Integrated Reliability Workshop (IRW) <2002, Lake Tahoe/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Life Cycle Information is a valuable information with many benefits for the manufacturer of electronic components. The knowledge about the loads in use support ongoing trends to pay on availability and pay on production. Especially online analysis for condition monitoring is a challenging benefit. Current approaches to life cycle data acquisition and analysis are presented. The principles of condition monitoring are discussed. The concept of a Life Cycle Information Unit and a prototype are presented.

: http://publica.fraunhofer.de/documents/N-122399.html