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Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops

: Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.


Tanner, D.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24 - 25 January 2005, San Jose, California, USA
Bellingham/Wash.: SPIE, 2005 (SPIE Proceedings Series 5716)
ISBN: 0-8194-5690-X
Conference "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS" <4, 2005, San Jose/Calif.>
Conference Paper
Fraunhofer IZM ()