Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments

: Eckert, T.; Müller, W.H.; Nissen, N.F.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.1 : San Diego, CA, USA, 26 - 29 May 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4475-5
Electronic Components and Technology Conference (ECTC) <59, 2009, San Diego/Calif.>
Conference Paper
Fraunhofer IZM ()

Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained from non-linear and temperature-dependent finite element analysis and lifetime experiments. We introduce temperature dependent coefficients and exponents for the Coffin-Manson-Basquin relationship considering elastic and plastic fatigue behavior. The results indicate that temperature is an important parameter affecting the solder joint vibration fatigue life.