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  4. A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments
 
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2009
Conference Paper
Title

A Solder Joint Fatigue Life Model for Combined Vibration and Temperature Environments

Abstract
Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained from non-linear and temperature-dependent finite element analysis and lifetime experiments. We introduce temperature dependent coefficients and exponents for the Coffin-Manson-Basquin relationship considering elastic and plastic fatigue behavior. The results indicate that temperature is an important parameter affecting the solder joint vibration fatigue life.
Author(s)
Eckert, T.
Müller, W.H.
Nissen, N.F.
Reichl, H.
Mainwork
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.1  
Conference
Electronic Components and Technology Conference (ECTC) 2009  
DOI
10.1109/ECTC.2009.5074064
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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