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Support of the Design Process for Advanced Electronic Components by Means of Finite Element Analysis
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2004
Book Article
Titel
Support of the Design Process for Advanced Electronic Components by Means of Finite Element Analysis
Author(s)
Sommer, J.-P.
Hauptwerk
Materials mechanics for system integration and packaging
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM