Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
| CS-MAX 2004, Compound Semiconductor Manufacturing Expo. Technical Digest. CD-ROM : Monterey, California, October 26 - 28, 2004
Bristol: IOP Publishing, 2004 |
| Compound Semiconductor Manufacturing Expo (CS-MAX) <2004, Monterey> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |