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Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
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2004
Conference Paper
Titel
Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Author(s)
Oppermann, H.
Hutter, M.
Jordan, R.
Klein, M.
Engelmann, G.
Wolf, J.
Reichl, H.
Hauptwerk
CS-MAX 2004, Compound Semiconductor Manufacturing Expo. Technical Digest. CD-ROM
Konferenz
Compound Semiconductor Manufacturing Expo (CS-MAX) 2004
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM