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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Photo-Resist Technology for Wafer Level Packaging and MEMS Applications

 
: Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D.

International Microelectronics and Packaging Society -IMAPS-:
15th European Microelectronics and Packaging Conference & Exhibition 2005. Conference programme & proceedings : June 12 - 15, 2005, Brugge, Belgium, IMAPS
Reston, Va.: IMAPS, 2005
European Microelectronics and Packaging Conference and Exhibition (EMPC) <15, 2005, Brugge>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120524.html