Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Low Temperature Au-Au Flip Chip Interconnections
| International Microelectronics and Packaging Society -IMAPS-:
The IMAPS Nordic Annual Conference 2008 : 14.-16.September, Helsingør, Denmark
IMAPS Nordic, 2008
ISBN: 978-9529975-14-3
pp.65-70 |
| International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) <2008, Helsingør/Denmark> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |