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Low Temperature Au-Au Flip Chip Interconnections

 
: Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
The IMAPS Nordic Annual Conference 2008 : 14.-16.September, Helsingør, Denmark
IMAPS Nordic, 2008
ISBN: 978-9529975-14-3
pp.65-70
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) <2008, Helsingør/Denmark>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120514.html