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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results

 
: Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.

Society for Microelectronics, Electronic Components and Materials -MIDEM-, Ljubljana:
EMPS 2006 - 4th European Microelectronics and Packaging Symposium with Table-Top Exhibition. Proceedings : May 21 - 24, 2006, Terme Catez, Slovenia
Terme Catez, 2006
ISBN: 961-91023-4-7
European Microelectronics and Packaging Symposium with Table-Top Exhibition (EMPS) <4, 2006, Terme Catez >
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120511.html