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Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach

Optimaler elektrischer Entwurf von AVT-System-Baugruppen und integrierten Kompnenten unter Verwendung des M3-Ansatzes
 
: Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.

:

Vaidyanathan, K. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2007, 9th Electronics Packaging Technology Conference. Vol.1 : 10 - 12 December 2007, Grand Copthorne Waterfront Hotel, Singapore
New York, NY: IEEE, 2007
ISBN: 1-4244-1324-9
ISBN: 978-1-4244-1324-9
pp.429-435
Electronics Packaging Technology Conference (EPTC) <9, 2007, Singapore>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this contribution, a novel design approach, the M3-approach (methodologies->models->measures), for efficient, reliable and cost-effective design of electronic system packages and integrated components is presented and illustrated using a system-in-package (SiP) module as well as a microstrip patch array antenna and an inductor, as examples. The M3-pproach entails developing or applying reliable methodologies for efficient and accurate modeling of system packages and integrated components; using the extracted and experimentally validated models to study the impact of different packaging technologies, integration options, component placement/routing possibilities, immediate surroundings as well as manufacturing tolerances on system performance; and finally, based on these studies, extracting reliable design measures. Applying these measures at the prelayout stage leads to the elimination of re-design efforts and place/route iterations. Consequently, time to market as well as cost is considerably reduced while performance is optimized.

: http://publica.fraunhofer.de/documents/N-120507.html