Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thermal Lap Shear Tests on MEMS Interconnect Solder joints

: Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B.

Proceedings of 11th International Conference on Fracture (ICF XI). CD-ROM : March 20-25 2005, Turin
ISBN: 978-88-903188-0-1
International Conference on Fracture (ICFXI) <11, 2005, Turin>
Conference Paper
Fraunhofer IZM ()

In recent years, solder joints have been continuously incorporated in electronics packages and MEMS-technology, too. The strong trend towards high-temperature applications can be observed in combination with the tendency to increasingly use of lead-free solders. Low deformation and stress distributions between the different interconnect components coupled with long-term reliability becomes a hot issue. A key factor of solder joint failure is the mismatch in the thermal expansion coefficient between the different individual components in various applications among them automotive, telecommunication or wide range of MEMS. Fatigue tests are directed in two main directions (i) thermal induced low cycle fatigue /1-4/ and (ii) mechanical loading such as vibrations and shocks /5/ as well. The combination of Finite-Element-Analysis (FEA) and advanced experimental testing methods are a suitable way to describe time and temperature dependent strength, fatigue and interface behaviour including the formulation of material laws of solders and adhesives, too. Measured deformation fields and material parameters are essential assumptions to predict the reliability and to predict the lifetime of multi-material structures and MEMS packaging.