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Simulation of Interface Cracks in Microelectronic Packaging

: Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.


Gdoutos, E.E.:
Fracture of Nano and Engineering Materials and Structures. Book + CD-ROM : Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006
Dordrecht: Springer Netherland, 2006
ISBN: 978-1-402-04972-9
ISBN: 978-1-402-04971-2 (print)
European Conference on Fracture (ECF) <16, 2006, Alexandroupolis>
Conference Paper
Fraunhofer IZM ()

Increasing use under harsh environmental conditions - extreme temperatures, in particular often lead to fatigue and failure of advanced electronic packages and related systems. As a result, its thermo-mechanical reliability becomes more and more one of the most important preconditions for adopting it in industrial applications.