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Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging

 
: Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B.

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Gdoutos, E.E.:
Fracture of Nano and Engineering Materials and Structures. Book + CD-ROM : Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006
Dordrecht: Springer Netherland, 2006
ISBN: 978-1-402-04972-9
ISBN: 978-1-402-04971-2 (print)
pp.737-738
European Conference on Fracture (ECF) <16, 2006, Alexandroupolis>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120490.html