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Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces

: Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.


Geer, R.E. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Testing, reliability, and application of micro- and nano-material systems IV : 28 February - 2 March 2006, San Diego, California, USA
Bellingham/Wash.: SPIE, 2006 (SPIE Proceedings Series 6175)
ISBN: 0-8194-6228-4
Conference "Testing, Reliability, and Application of Micro- and Nano-Material Systems" <4, 2006, San Diego/Calif.>
Conference Paper
Fraunhofer IZM ()

With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a variety of
market segments new reliability issues will arise. The understanding of material interfaces is the key for a successful
design for reliability of MEMS/NEMS and sensor systems. Furthermore in the field of BIOMEMS newly developed
advanced materials and well known engineering materials are combined despite of fully developed reliability concepts
for such devices and components. In addition the increasing interface-to volume ratio in highly integrated systems and
nanoparticle filled materials are challenges for experimental reliability evaluation. New strategies for reliability
assessment on the submicron scale are essential to fulfil the needs of future devices. In this paper a nanoscale resolution
experimental method for the measurement of thermo-mechanical deformation at material interfaces is introduced. The
determination of displacement fields is based on scanning probe microscopy (SPM) data. In-situ SPM scans of the
analyzed object (i.e. material interface) are carried out at different thermo-mechanical load states. The obtained images
are compared by grayscale cross correlation algorithms. This allows the tracking of local image patterns of the analyzed
surface structure. The measurement results are full-field displacement fields with nanometer resolution. With the
obtained data the mixed mode type of loading at material interfaces can be analyzed with highest resolution for future
needs in micro system and nanotechnology.