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Microelectronics to Nanoelectronics - Reliability and Packaging Considerations

 
: Michel, B.; Reichl, H.

Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
Advanced Packaging Conference 2006 : In conjunction with SEMICON Europa 2006 "Wafer Level Packaging and Beyond: From samples to volumes"; April 4, 2006; Munich, Germany
München, 2006
SEMICON Europa <2006, München>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120479.html