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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Applied encapsulation methods and materials in mechatronics

 
: Rebholz, C.; Badstübner, K.; Ansorge, F.

International Microelectronics and Packaging Society -IMAPS-, Section Francaise:
First European Advanced Technology Workshop on Mechatronics 2005. CD-ROM : Held in Poitiers Futuroscope, France on January 17-19, 2005
Poitiers: IMAPS France, 2005
European Advanced Technology Workshop on Mechatronics <1, 2005, Poitiers>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120465.html