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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging

 
: Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.

Surface Mount Technology Association -SMTA-:
International Wafer-Level Packaging Congress, IWLPC 2004. CD-ROM : October 10 - 12, 2004, Doubletree Hotel San Jose, San Jose, California
Edina, Minn.: SMTA, 2004
International Wafer-Level Packaging Congress (IWLPC) <1, 2004, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120460.html