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Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
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2004
Conference Paper
Titel
Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Author(s)
Töpper, M.
Glaw, V.
Zoschke, K.
Jung, E.
Becker, K.-F.
Ehrmann, O.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
International Wafer-Level Packaging Congress, IWLPC 2004. CD-ROM
Konferenz
International Wafer-Level Packaging Congress (IWLPC) 2004
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM