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Sustainable Development of Microelectronic Technology Processes

 
: Griese, H.; Schischke, K.; Reichl, H.; Stobbe, L.

:

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04)
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8620-5 (print)
ISBN: 0-7803-8621-3 (CD-ROM)
pp.154 - 159
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis <6, 2004, Shanghai>
English
Conference Paper
Fraunhofer IZM ()

Abstract
As long as basic technology development in the field of electronics is still nearly independent of environmental or sustainability-oriented application requirements, e.g. product and system design, an increase in eco-efficiency of manufacturing processes is an important aspect for a sustainable development. Like for products the environmental as well as sustainability impact will be fixed in the first stages of the development, it is the them in the design of manufacturing processes. Material choice, evaluation of process steps and estimated production volume determine not only production cost but they fix the overall environmental impacts as well.
During this developing phase there are only a few certain data available in most cases. A reliable assessment is therefore nearly impossible. To find however an optimised solution, it is important to make life-cycle know how available by involving ecodesign experts in the developing teams. Only in doing so, wrong or inefficient developments can be early identified and avoided at low cost.
By this meaning, successful process developments are described to show how costs and environmental impacts were reduced by cooperation of technologists and ecodesigners. Especially waferlevel bumping packaging process and production technologies for smart tags are in focus.

: http://publica.fraunhofer.de/documents/N-120452.html