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Lead free solder joints: reliability and metallurgical reactions

: Hutter, M.; Schmidt, R.; Pape, U.; Oppermann, H.; Reichl, H.

Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings : Joint International Congress and Exhibition "Electronics Goes Green 2008+". September 7 - 10, 2008, Berlin, Germany
Stuttgart: Fraunhofer IRB Verlag, 2008
ISBN: 3-8167-7668-X
ISBN: 978-3-8167-7668-0
Joint International Congress and Exhibition "Electronics Goes Green 2008+" <2008, Berlin>
Conference Paper
Fraunhofer IZM ()

The electronics industry has successfully transitioned to lead free soldering for computer and consumer products while in the automotive industry due to the high reliability requirements there this step is still in an ongoing proc-ess. In order to ensure or even enhance the reliability of solder joints, i.e. the board level reliability, in electronic devices besides gaining mechanical data and developing predictive fatigue models research work has already been launched to understand the effect of choice and amount of certain elements the solder alloys comprise. However, the influence of adding certain elements by means of alloying or application of surface coatings on the mechanical properties, strengthening mechanisms and the microstructure is not totally understood. In this work the effect of using an electroplated Fe pad metallization (and for comparison reasons using electroless Ni/P) to-gether with the lead free solders SnAg3.0Cu0.5 (SAC305) and SAC plus Bi, Sb and Ni as well as SnPb37 eutec-tic as reference on the formation and growth of intermetallic phases is discussed.