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Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations

 
: Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.

:

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
Piscataway, NJ, USA: IEEE Press, 2009
ISBN: 978-1-4244-2127-5
pp.204-211
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <9, 2008, Freiburg/Brsg.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120402.html