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Simulation Based Analysis of Secondary Effects on Solder Fatigue

 
: Dudek, R.; Doering, R.; Bombach, C.; Michel, B.

:

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
Piscataway, NJ, USA: IEEE Press, 2009
ISBN: 978-1-4244-2127-5
pp.105-112
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <9, 2008, Freiburg/Brsg.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120399.html