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Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions

 
: Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.

Micromaterials and nanomaterials 4 (2005), pp.31
ISSN: 1619-2486
MicroCar <2005, Leipzig>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120395.html