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Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
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2007
Conference Paper
Titel
Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Author(s)
Auersperg, J.
Klein, M.
Michel, B.
Hauptwerk
8th International Conference on Electronics Packaging Technology, ICEPT 2007
Konferenz
International Conference on Electronics Packaging Technology (ICEPT) 2007
DOI
10.1109/ICEPT.2007.4441403
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM