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Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging

 
: Dudek, R.; Walter, H.; Auersperg, J.; Michel, B.

:

Institute of Electrical and Electronics Engineers -IEEE-:
Polytronic 2007, 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics : Odaiba, Tokyo, Japan, January 15-18, 2007
Piscataway, NJ, USA: IEEE Press, 2007
ISBN: 978-1-4244-1186-3
pp.220-227
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <6, 2007, Tokio>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120384.html