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Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
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2005
Conference Paper
Titel
Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Author(s)
Auersperg, J.
Seiler, B.
Cadalen, E.
Dudek, R.
Michel, B.
Hauptwerk
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2005
DOI
10.1109/ESIME.2005.1502799
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM