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Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
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2006
Conference Paper
Titel
Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Author(s)
Dudek, R.
Rzepka, S.
Dobritz, S.
Döring, R.
Kreißig, K.
Wiese, S.
Michel, B.
Hauptwerk
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.2
Konferenz
Electronics Systemintegration Technology Conference (ESTC) 2006
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM