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Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints

 
: Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B.

Micromaterials and nanomaterials 6 (2007), pp.116
ISSN: 1619-2486
International Congress on Microreliability and Nanoreliability in Key Technology Applications (MNR) <1, 2007, Berlin>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120340.html