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Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
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2007
Conference Paper
Titel
Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Author(s)
Kaulfersch, E.
Rzepka, S.
Ganeshan, V.
Müller, A.
Michel, B.
Hauptwerk
MicroNanoReliability 2007, 1st World Congress MicroNanoReliability
Konferenz
International Congress on Microreliability and Nanoreliability in Key Technology Applications (MNR) 2007
World Congress MicroNanoReliability 2007
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM