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Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique, in Micro- and Opto-Electronic Materials and Structures

 
: Michel, B.; Keller, J.

:

Suhir, E.; Lee, Y.C.; Wong, C.P.:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Part 4
New York: Springer, 2007
ISBN: 978-0-387-27974-9 (print)
ISBN: 978-0-387-32989-5 (online)
pp.B233-B250
English
Book Article
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-120279.html