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Highlights from 2007 iNEMI Environmental Roadmap

 
: Nissen, N.F.

Reichl, H.:
Systemintegration in der Mikroelektronik: Architektur und Technologien für Hochstromleiterplatten und Wärmemanagement : SMT Hybrid Packaging, Messe & Kongress, Nürnberg 24. - 26. April 2007
Berlin: VDE-Verlag, 2007
ISBN: 3-8007-3022-7
ISBN: 978-3-8007-3022-3
Messe und Kongress "Systemintegration in der Mikroelektronik" (SMT/HYBRID/PACKAGING) <2007, Nürnberg>
English
Conference Paper
Fraunhofer IZM ()

Abstract
To remain competitive, the electronics industry must continue to keep pace with emerging: - material restrictions, - end-of life requirements, - customer preferences for energy efficient products, - holistic design requirements. While meeting increasing reliability requirements: - many electronic materials will change over the next decade to meet performance & reliability requirements.

: http://publica.fraunhofer.de/documents/N-119995.html