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Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications

 
: Auersperg, J.; Michel, B.

Keyun, B. ; Institute of Electrical and Electronics Engineers -IEEE-; China Electronic Packaging Society:
7th International Conference on Electronics Packaging Technology 2006 : Shanghai, China, August 26 to 29, 2006
Piscataway, NJ: IEEE Operations Center, 2006
ISBN: 1-424-40619-6
ISBN: 1-424-40620-X
International Conference on Electronics Packaging Technology (ICEPT) <7, 2006, Shanghai>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-119971.html