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Thin film integration of passives - single components, filters, integrated passive devices

 
: Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.

:

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1 : Las Vegas, Nevada, USA, June 1 - 4, 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8365-6
ISBN: 0-7803-8366-4
pp.294-301
Electronic Components and Technology Conference (ECTC) <54, 2004, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The increasing demands on future electronic products require more efficient system integration technologies. Especially the package density gap at board level with the high integrated circuits (ICs) on the one hand and the discrete passive components on the other has to be closed by new packaging technologies which integrate the passive components into the substrate, an interposer or the IC itself. This paper presents investigations for the common integration of inductors, resistors, capacitors as well as passive filter structures in a thin film build up, based on copper and benzocyclobutene (BCB). Technologies from wafer level packaging were adapted for manufacturing of the integrated components. The examinations were carried out with special focus on integrated coils and passive filter structures. Build up, design, processing as well as results of the electrical characterization of the integrated components are described in detail. Furthermore, an integrated passive device (IPD) for application as a filter element in the Bluetooth band is presented

: http://publica.fraunhofer.de/documents/N-119963.html