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Using Life Cycle Information to Improve the Reliability of Electronic Assemblies

 
: Middendorf, A.; Griese, H.; Neß, O.; Reichl, H.

World Electronic Circuits Council -WECC-; European Institute of Printed Circuits -EIPC-:
Electronic Circuits World Convention. Proceedings. CD-ROM
2002
Electronic Circuits World Convention <9, 2002, Köln>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Life Cycle Information is a valuable information with many benefits for the manufacturer of electronic components. The knowledge about the loads in use support ongoing trends to pay on availability and pay on production. Especially online analysis for condition monitoring is a challenging benefit. Current approaches to life cycle data acquisition and analysis are presented. The principles of condition monitoring are discussed. The concept of a Life Cycle Information Unit is presented and a prototype is discussed in detail.

: http://publica.fraunhofer.de/documents/N-119293.html