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Physical design and technology parameters for vertical system-in-package integration

Physikalischer Entwurf und Technologieparameter für vertikale SiP-Integration
 
: Polityko, D.-D.; Guttowski, S.; John, W.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
28th International Spring Seminar on Electronics Technology 2005 : May 19 - 22, 2005, Wiener Neustadt, Austria
New York, NY: IEEE, 2005
ISBN: 0-7803-9324-4
pp.399-405
International Spring Seminar on Electronics Technology (ISSE) <28, 2005, Wiener Neustadt>
German
Conference Paper
Fraunhofer IZM ()

Abstract
The physical design for vertical integration is considered to be a relatively new research field. The novel approach of physical design structure, design oriented classification of vertical SiP technologies and key parameters for technology selection are presented in this paper

: http://publica.fraunhofer.de/documents/N-119264.html