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Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

 
: Niedermayer, M.; Guttowski, S.; Thomasius, R.; Polityko, D.; Schrank, K.; Reichl, H.

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Association for Computing Machinery -ACM-, Special Interest Group on Embedded Systems -SIGBED-; IEEE Signal Processing Society:
IPSN 2006, Fifth International Symposium on Information Processing in Sensor Networks : April 19 - 21, 2006, Nashville, Tennessee, USA
New York: ACM, 2006
ISBN: 1-59593-334-4
pp.391-398
International Symposium on Information Processing in Sensor Networks (IPSN) <5, 2006, Nashville/Tenn.>
German
Conference Paper
Fraunhofer IZM ()

Abstract
Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. Starting from the functional analysis, the local hardware architecture is selected according to the required com-ponent dimensions. A cycle-accurate simulator was implemented to better predict volume shares. Afterwards, the potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implement-tations based on different 3D integration technology platforms.

: http://publica.fraunhofer.de/documents/N-119257.html