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Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models

 
: Middendorf, A.; Griese, H.; Reichl, H.

:

Yamamoto, R. ; Union of EcoDesigners Japan; IEEE Computer Society, Technical Committee on Electronics and the Environment:
Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing 2005. Proceedings : December 12 - 14, 2005, Tokyo, Japan
Tokyo: Union of EcoDesigners, 2005
ISBN: 1-4244-0081-3
pp.614-619
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <4, 2005, Tokyo>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Furthermore such information could improve future product design, market research and quality management. This paper describes a modular concept for life-cycle monitoring, as well as the identification of use conditions, reliability assessment and diagnosis of Insulated Gate Bipolar Transistors (IGBT) especially the wire bond interconnections.

: http://publica.fraunhofer.de/documents/N-119253.html