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2005
Conference Paper
Titel
Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models
Abstract
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Furthermore such information could improve future product design, market research and quality management. This paper describes a modular concept for life-cycle monitoring, as well as the identification of use conditions, reliability assessment and diagnosis of Insulated Gate Bipolar Transistors (IGBT) especially the wire bond interconnections.