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Embedded Life-Cycle Information Module

 
: Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-:
EcoDesign '03, 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing : December 8 - 11, 2003, Tokyo, Japan
Piscataway, NJ: IEEE Operations Center, 2003
ISBN: 0-7803-8590-X
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <3, 2003, Tokyo>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Further, it could improve design, market research and quality management. - This paper describes a modular concept of a Life-Cycle Information Module (LIM) for life-cycle monitoring, identification of use conditions, reliability assessment and diagnosis. A MEMS-based prototype is discussed, which measures, identifies, and records data strongly correlated with the degradation of a product during its use phase. It is designed to get embedded in various products. The product?s remaining life time can be estimated during its use by dedicated algorithms implemented in the LIM?s data processing unit The data recorded can be retrieved either during the use stage or after product takeback.

: http://publica.fraunhofer.de/documents/N-119198.html