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Deployment of State-of -the-Art Technology for Implantable Medical Systems

 
: Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H.

Welterlen, J.D. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 1998. Proceedings : November 1 - 4, 1998, San Diego Convention Center, San Diego, California
Reston, Va.: IMAPS, 1998 (SPIE Proceedings Series 3582)
ISBN: 0-930815-52-1
pp.755-758
International Symposium on Microelectronics <1998, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper describes the development approach for HIREL electronic applications that require further size, weight, and cost reductions while their performance and reliability are improved in parallel. The project was divided into thre parts: system/product design, component engineering and assembly process development. This paper will focus on the top-down product design process that led to a concept where an entire new technology protfolio for manufacturing electronic packages was tailored to components, processes, and materials to allow an optimum fit: modular matching as a result of synergistic engineering.

: http://publica.fraunhofer.de/documents/N-119183.html