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Condition monitoring of microsystems supporting sustainability

: Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H.

Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings : Joint International Congress and Exhibition "Electronics Goes Green 2008+". September 7 - 10, 2008, Berlin, Germany
Stuttgart: Fraunhofer IRB Verlag, 2008
ISBN: 3-8167-7668-X
ISBN: 978-3-8167-7668-0
Joint International Congress and Exhibition "Electronics Goes Green 2008+" <2008, Berlin>
World ReUse Forum <1, 2008, Berlin>
Conference Paper
Fraunhofer IZM ()

Information about the condition of electronic systems in use supports sustainability, reliability, maintenance and safety. This paper describes different approaches to condition monitoring supporting sustainability. In this context guidelines to sustainable design of electronic products are discussed. The concept of Life Time Indicators using so called monitor structures is explained in detail and illustrated with an example. With monitor structures, the remaining life time of a system can be estimated in field use under varying load. The design and evaluation of monitor structures sensible to thermo-mechanical load is shown. Technological boundaries are taken into consideration and an example of a flip chip based monitor structure is presented. Conclusions are drawn for further development of sustainable condition monitoring using Life Time Indicators.