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Funktionseinheit und Verfahren zu deren Herstellung

Functional unit i.e. flexible substrate layer, for use in electronic device of electronic system, has active/passive electronic components enclosed by flexible dielectric layer, and contacts at outer side of unit for contacting components
 
: Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.

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Frontpage ()

DE 102008022733 A: 20080505
DE 102008022733 A: 20080505
H01L0021
H01L0023
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
(A1) Die vorliegende Erfindung betrifft eine Funktionseinheit (14), enthaltend mindestens eine aktive oder passive elektronische Komponente (6), wobei diese von mindestens einer flexiblen dielektrischen Schicht (4, 7, 9, 11) eingefasst ist und an der Aussenseite der Funktionseinheit Kontakte (3, 12) zur Ankontaktierung der elektrischen Komponenten (6) fuer die weitere Montage vorgesehen sind.

 

DE 102008022733 A1 UPAB: 20091130 NOVELTY - The unit has active or passive electronic components i.e. integrated circuit, enclosed by a flexible dielectric layer, where contacts are provided at an outer side of the unit for contacting the components for assembly. The components are arranged in layers of the unit, and are connected with each other in an electrically conductive manner, where thickness of the components amounts to 15 to 100 micrometers preferably 1 power 5 to 20 micrometers. A wiring level is provided in the dielectric layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for producing a functional unit. USE - Functional unit i.e. flexible substrate layer (claimed), for use in an electronic device of an electronic system or subsystem. ADVANTAGE - The unit is designed in such a manner that it has desired mechanical flexibility and space saving arrangement and is produced in a rapid and cost-effective manner, integration of the electronic components is enabled, and the electronic components are mechanically protected, and higher degree of miniaturization, reduced number of necessary process steps and reduced risk of breakage in daily operation of heavy objects are achieved, thus providing a compact electronic system.

: http://publica.fraunhofer.de/documents/N-118943.html