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Verfahren zur Kontaktierung, Zusammensetzung fuer die Chipkontaktierung sowie deren Verwendung

Composition, useful for contacting contact surfaces of chip with contacts of substrate in the flip-chip assembly, comprises monomer formed by polymerization of reactive resin-matrix, lead-line body and flux compatible with matrix
 
: Bauer, J.; Kallmayer, C.; Pahl, B.

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Frontpage ()

DE 102008027558 A: 20080610
DE 102008027558 A: 20080610
B23K0035
H01L0021
C08F0220
C08G0059
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
(A1) Die Erfindung betrifft eine Zusammensetzung fuer die Kontaktierung von Kontaktflaechen eines Chips mit den Kontakten eines Substrats. Sie wird durch die Polymerisation eines eine Reaktivharz-Matrix ausbildenden Monomers, mindestens eines Lotkoerpers sowie mindestens eines mit der Reaktivharz-Matrix kompatiblen Flussmittels erhalten. Ebenso umfasst die Erfindung die Verwendung der Zusammensetzung zur Chipkontaktierung sowie ein Verfahren zur Kontaktierung von Kontaktflaechen eines Chips in der Flip-Chip-Montage.

 

DE 102008027558 A1 UPAB: 20100107 NOVELTY - Composition comprises at least a monomer formed by polymerization of a reactive resin-matrix, at least a lead-line body and at least a flux compatible with the reactive resin-matrix. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a process for contacting contact surfaces of a chip with contacts of a substrate in the flip-chip assembly, comprising: (a) applying the composition on a surface of the chip, at least regionwise; (b) inducing a partial crosslinking of the monomers so that a lot of physical freedom of movement guaranteed; (c) contacting the chip on the bearing surface of the composition with a substrate; and (d) hardening the reaction resin matrix in duroplastic condition by thermal treatment above the melting point of the lot-material, where the contact area of the chip and the contact of the substrate takes place. USE - The composition is useful for contacting contact surfaces of a chip with contacts of a substrate in the flip-chip assembly. The composition is useful in the applications of dispensing, jetting, dipping, printing, stencil printing or screen printing and/or casting (all claimed). ADVANTAGE - The composition provides rapid contact and brazed connection, in which no subsequent underfilling is required and the process carried out without pressure during the contact phase.

: http://publica.fraunhofer.de/documents/N-118912.html