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Solarzelle und Verfahren zur Herstellung einer Solarzelle

Solar cell useful in solar cell module, comprises semiconductor substrate having front and rear sides, metallic contact structures, and electroconductive connection structures, where the substrate has doped regions of doping types
 
: Clement, F.; Biro, D.; Menkoe, g.; Kubera, T.

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Frontpage ()

DE 102008033632 A: 20080717
DE 102008033632 A: 20080717
H01L0031
German
Patent, Electronic Publication
Fraunhofer ISE ()

Abstract
(A1) Die Erfindung betrifft eine Solarzelle, umfassend ein Halbleitersubstrat mit einer Vorder- und einer Rueckseite, eine erste und mindestens eine zweite metallische Kontaktstruktur, wobei das Halbleitersubstrat mindestens einen ersten Dotierbereich eines ersten Dotierungstyps und mindestens einen zweiten Dotierbereich eines zweiten, zum ersten Dotierungstyp entgegengesetzten Dotierungstyps aufweist und der erste und der zweite Dotierungstyp zumindest teilweise aneinandergrenzend angeordnet sind, zur Ausbildung eines pn-Uebergangs, wobei beide Kontaktstrukturen an einer Metallisierungsseite des Halbleitersubstrates angeordnet sind und die Metallisierungsseite die Vorder- oder die Rueckseite der Solarzelle ist und wobei die erste Kontaktstruktur mit dem ersten Dotierbereich elektrisch leitend verbunden ist und die zweite Kontaktstruktur mit dem zweiten Dotierbereich elektrisch leitend verbunden ist, dadurch gekennzeichnet, dass die Solarzelle weiterhin eine erste und mindestens eine zweite elektrisch leitende Verbindungsstruktur umfasst, die beide an der Metallisierungsseite der Solarzelle angeordnet sind, wobei die erste Kontaktierungsstruktur zumindest teilweise von einer elektrisch nicht leitenden Isolierungsschicht bedeckt ist, welche zumindest teilweise von der ersten Verbindungsstruktur bedeckt ist und ebenso die zweite Kontaktierungsstruktur zumindest teilweise von einer elektrisch nicht leitenden Isolierungsschicht bedeckt ist, welche zumindest teilweise von der ...

 

DE 102008033632 A1 UPAB: 20100204 NOVELTY - The solar cell comprises a semiconductor substrate (1) having a front side and a rear side, first (3a) and second metallic contact structures, and first and second electroconductive connection structures, where the semiconductor substrate has a first doped region of a first doping type and a second doped region of a second doping type that is opposite to the first doping type. The first and second doping types are partially arranged adjacent to each other for forming a pn-junction. The contact structures are arranged at a metallization side of the semiconductor substrate. DETAILED DESCRIPTION - The solar cell comprises a semiconductor substrate (1) having a front side and a rear side, first (3a) and second metallic contact structures, and first and second electroconductive connection structures, where the semiconductor substrate has a first doped region of a first doping type and a second doped region of a second doping type that is opposite to the first doping type. The first and second doping types are partially arranged adjacent to each other for forming a pn-junction. The contact structures are arranged at a metallization side of the semiconductor substrate and the metallization side is the front- and rear side of the solar cell. The first and second contact structures are electroconductively connected with the first and second doped regions respectively. The electroconductive connection structures are arranged at the metallization side of the solar cell. The contact structures are partially covered by an electrically non-conducting insulating layer, which is partially covered by the connection structures. The first and second connection structures are electroconductively connected with the first and second contact structures respectively. The insulating layer and the first and second connection structures are integral component of the solar cell, and exceed in their dimensions parallel to the metallization side not over the dimensions of the solar cell. The contact structures are completely covered with the insulating layer up to hole-like recesses and the connection structures directly adjoin to the assigned contact structures in the hole-like recesses for forming an electrically conducting connection. The connection structures have a cross-sectional surfaces counter-rotatingly increasing and decreasing parallel to the metallization side, so that the cross-sectional surface of the first connection structure outcoming from the first edge region of the solar cell linearly decreases to a second edge region of the solar cell that is opposite to the first edge region and the cross-sectional surface of the second connection structure outcoming from the first edge region linearly increases to the second edge region. The first edge region and the second edge region are formed for bringing a cell binder. One of the contact structures has a solder pad and is covered with the insulating layer such that the insulating layer has a recess in the area of the solder pad, so that the assigned connection structure directly adjoins to the solder pad to form the electrically conducting connection. The solar cell corresponds to a metal wrap through-solar cell in the basic construction of the structure. The substrate has a through-plating (7), which electroconductively connects the metallization side with the opposing side of the solar cell using a metallic through-connection. The first contact structure on the metallization side adjoins to the metallic through-connection for forming the electrically conducting connection. The first contact structure is covered with the insulating layer, so that the insulating layer has a recess in the area, at which the through-connection adjoins to the contact structure. The first contact structure and the through-connection are produced in a process step. An INDEPENDENT CLAIM is included for a method for manufacturing a solar cell. USE - Solar cell useful in a solar cell module (claimed). ADVANTAGE - The solar cell can be economically, optimally and simply manufactured and interconnected with high efficiency and improved light-coupling properties, and enables an optimal collection of charge carriers from the semiconductor substrate.

: http://publica.fraunhofer.de/documents/N-118878.html