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2004
Conference Paper
Titel
Trends in RF & Wireless Packaging
Abstract
!Introduction & Heterointegration !System Integration on Wafer Level !Chip Scale Packaging, 3-D integration, bumping, Integration of Passives, MEMS !System Integration on Board and Flexibel Substrates !Chip in Polymer, High Density (Flex) Interconnect !Polytronic, cost-efficient Systemintegration on Flexible Substrates.