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Technologies for functional hetero-system integration on foil

 
: Bock, K.; Adler, C.; Bollmann, D.; Klink, G.; Feil, M.; Strohhöfer, C.

Gessner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart systems integration 2007 : Paris, France 27. - 28.03.2007; With CD-ROM / 1st European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2007
ISBN: 3-8007-3009-X
ISBN: 978-3-8007-3009-4
pp.191-198
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <1, 2007, Paris>
English
Conference Paper
Fraunhofer IZM ()

Abstract
2-conductor Flex for R2R Organic Electronics in R2R Thin Chip Integration for R2R Micro-Systems in R2R - Smart Plastics

: http://publica.fraunhofer.de/documents/N-118573.html