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Laser water-jet based dicing

 
: Frauenhoffer, F.

European Semiconductor 22 (2000), No.4, pp.S109-S110
ISSN: 0265-6027
ISSN: 0957-5685
English
Journal Article
Fraunhofer IPA ()
Dicing Technology; laser; Wasserstrahl; Halbleiter; Fertigung; Schneiden

Abstract
An independent survey by the Fraunhofer IPA, Stuttgart, Germany shows promising potential for the latest in dicing technology.

: http://publica.fraunhofer.de/documents/N-1176.html