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Simulation of a modular die stamp for micro impact extrusion

: Schubert, A.; Pohl, R.; Hackert, M.

Multiphysics Modeling and Simulation. 3rd European COMSOL Conference 2009. CD-ROM : October 14-16, 2009, Milano
Milano, 2009
ISBN: 978-0-9825697-2-6
6 pp.
European COMSOL Conference <3, 2009, Milano>
Conference Paper
Fraunhofer IWU ()
microforming; impact extrusion; precision cavity; SFB/Transregio 39 PTPIESA

Micro impact extrusion is investigated at Chemnitz University of Technology as a potential procedure for large area machining of micro cavities within the scope of the SFB/Transregio 39 PT-PIESA of the German Research Foundation [1, 2, 3]. Applying impact extrusion micro forming is done by material flow opposite to the effective direction of the force into the structure of the tool. Therefore no structured lower die plates are necessary, but high forming forces are required. Figure 1 shows a scheme of the tool system developed at Chemnitz UT. In this tool system modular micro stamps can be implemented, which consist of several single stamp elements. In this study COMSOL Multiphysics is used to analyze the stress in such modular tool stamps. The results help to redesign the stamp after first experimental investigations.