Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Verknüpfung der geometrischen und elektrischen Parameter vertikaler Kontaktierungen aus flexiblen Substraten für 2.5D System-in-Package Entwurf
| Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 57th Electronic Components and Technology Conference 2007. Vol.5 : Sparks, NV, 29 May - June 1, 2007
Piscataway/NJ: IEEE, 2007
ISBN: 1-4244-0984-5
ISBN: 1-4244-0985-3
pp.1861-1865 |
| Electronic Components and Technology Conference (ECTC) <57, 2007, Reno/Nev.> |
|
| English |
| Conference Paper |
| Fraunhofer IZM () |