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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Embedded Chip Packages Technology and Applications

 
: Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter:
IMAPS Nordic Annual Conference 2009 : Tønsberg, Norway, 2009, September 13 - 15
Red Hook, NY: Curran, 2009
ISBN: 978-1-62276-183-8
pp.2429
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) <2009, Tønsberg>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-115314.html